What innovative developments have Board to Board Connectors seen under the trend of miniaturization of electronic products?
Publish Time: 2024-08-09
As electronic products continue to develop towards miniaturization, Board to Board Connectors have also seen many innovative developments.
In terms of structural design, Board to Board Connectors continue to improve in a more compact, lighter and thinner direction. For example, a low-profile design is adopted to reduce the overall height of the connector so that it can adapt to increasingly thinner electronic products. At the same time, by optimizing the internal pin layout, more signal transmission channels are achieved in a limited space, improving space utilization. Some connectors also adopt a stacking design that allows multiple circuit boards to be connected in a vertical direction, further saving plane space and leaving more room for other components inside electronic products.
Material innovation is also key. New high-strength, lightweight materials are used in the manufacture of Board to Board Connectors. These materials can not only ensure the mechanical strength and stability of the connector, but also reduce the overall weight. For example, some high-performance engineering plastics replace the traditional heavier metal shell parts, while having good insulation and temperature resistance. In terms of conductive materials, thinner wires and more advanced plating technology are used to improve signal transmission efficiency while reducing the size of pins.
In terms of connection technology, some new ways have emerged to meet the needs of miniaturization. For example, micro-pin connection is used to achieve reliable electrical connection through tiny elastic pins. This connection method takes up very little space and can provide stable contact. Magnetic connection technology has also begun to be applied to Board to Board Connectors, which is not only convenient and fast, but also can reduce the complexity of mechanical structure in miniaturized design. In addition, in order to meet the requirements of miniaturized electronic products for heat dissipation, some Board to Board Connectors also integrate heat dissipation functions. Through special materials or structural designs, the heat generated by the circuit board is effectively dissipated to ensure the stable operation of electronic products. In short, Board to Board Connectors continue to meet market needs through innovations in structure, materials, and connection technology under the trend of miniaturization of electronic products.
